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Brand Name : YDY
Model Number : S-005
Certification : ISO13485, IATF16949, ISO9001
Place of Origin : China
MOQ : 1pcs
Price : Negotiatable
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability : 100000/month
Delivery Time : 1-5 working days
Packaging Details : Anti-static bag + white pearl cotton (used around the inside of the carton) + carton
Name : 10oz Double Sided PCB Assembly Prodcution Contract Manufacturing
Service : Double Sided PCB Assembly
Applied to : moblie phone,bluetooth,computer
Soldermask Bridge Width : 0.1mm(5mil) min./0.08mm(3mils) min.
Board Cutting : V-cut,Routing
Copper Weight : 0.2oz-10oz
Inner package : Vacuum packing
Outline Tolerance : 0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching
10oz Double Sided PCB Assembly Prodcution Contract Manufacturing
Our Services
 Providing Expert Resources: Our Engineers are highly skilled in Electronic Design and follow many good practices including High-Speed, Multi-Layer, High Density PCB Design techniques. 
Double Sided PCB capability:
| Item | Specification | |
| 1 | Numbr of Layer | 1-16 Layers (standard) | 
| 2 | Material | FR4, Aluminum, FPC | 
| 3 | Surface Finish | HASL(LF), Gold plating, Enig,Immersion gold, Immersion Tin, OSP | 
| 4 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) | 
| 5 | Copper Thickness | 1/2 oz min;12 oz max | 
| 6 | Solder Mask | Green/Black/White/Red/Blue/Yellow | 
| 7 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) | 
| 8 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) | 
| 9 | Min.Hole Diameter for punching | 0.9mm(35mil) | 
| 10 | Biggest panel size | 610mm*508mm | 
| 11 | Hole Positon | +/-0.075mm(3mil) CNC Driling | 
| 12 | Conductor Width(W) | 0.05mm(2mil)or;+/-20% of original artwork | 
| 13 | Hole Diameter(H) | PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil) | 
| 14 | Outline Tolerance | 0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching | 
| 15 | Warp & Twist | 0.70% | 
| 16 | Insulation Resistance | 10Kohm-20Mohm | 
| 17 | Conductivity | <50ohm | 
| 18 | Test Voltage | 10-300V | 
| 19 | Panel Size | 110×100mm(min);660×600mm(max) | 
| 20 | Layer-layer misregistration | 4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max | 
| 21 | Min.spacing between hole edge to circuity pattern of an inner layer | 0.25mm(10mil) | 
| 22 | Min.spacing between board ouline to circuitry pattern of an inner layer | 0.25mm(10mil) | 
| 23 | Board thickness tolerance | 4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil) | 
| 24 | Impedance Control | +/-10% | 
|   | 
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